Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components.The cooling device will not be able to effectively reduce the heat of electronic components.This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment.
Features

1.Good thermal performance.2.Soft and high compressibility, vibration shock absorber.3.Self-adhesive.4.Easy construction.5.Electrical insulation6.Complies ROHS and UL environmental requirements.7.Provide a variety of thickness to choose.
Application:
Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone

In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
Product Parameters

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